Hi folks.
I finally settled on a Trendnet TEW-633 and want to add heatsinks to the chips inside. I remember the D-Link DIR-655 A3 I had came with one metal H/S, and one ceramic tile(?) H/S used on the Ubicom chip. I'm wondering why were two metal H/S not used as in the A1 revision. Would it be okay to use two metal H/S on my TEW-633 or is there a specific reason D-Link used the ceramic-looking tile?
I finally settled on a Trendnet TEW-633 and want to add heatsinks to the chips inside. I remember the D-Link DIR-655 A3 I had came with one metal H/S, and one ceramic tile(?) H/S used on the Ubicom chip. I'm wondering why were two metal H/S not used as in the A1 revision. Would it be okay to use two metal H/S on my TEW-633 or is there a specific reason D-Link used the ceramic-looking tile?